Testonica lab
Contents
- Testonica Lab appoints Air-TeQ because the first Distributor for convenient Instruments
- Testonica delivers technology for Marginal Defect recognition on DDR3/4 bus
- Testonica Lab appoints Air-TeQ because the first Distributor for convenient Instruments
- Testonica delivers technology for Marginal Defect recognition on DDR3/4 bus
- IEEE I&M Magazine printed our technical paper
- TTÜst sirgunud start-up Testonica Lab teeb koostööd IBMi ja Ericssoniga
Testonica Lab appoints Air-TeQ because the first Distributor for convenient Instruments
- 06.02.2018
- Embedded Instrumentation
Air-TeQ
Quick Instruments

Testonica Lab just signed an agreement with Air-TeQ for that sales and distribution of their Quick Instruments solutions within the Nordic, Baltic and Benelux area. “Testonica is a valued partner of ours already for quite some time, so it’s additionally a pleasure for all of us their Quick Instruments are actually ready for distribution”, states Director at Air-TeQ, Lars Kongsted-Jensen. “It’s opening new doorways to all of us their embedded instrument IPs now may be used inside a more open and versatile way”.
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Testonica delivers technology for Marginal Defect recognition on DDR3/4 bus
- 26.09.2017
- ChipVORX
DDR3
DDR4
Embedded Instrumentation
FPGA
Marginal Defects
NFF
No-fault Found
Little Difficulty Found
NTF
Quick Instruments

Testonica Lab appoints Air-TeQ because the first Distributor for convenient Instruments
- 06.02.2018
- Embedded Instrumentation
Air-TeQ
Quick Instruments

Testonica Lab just signed an agreement with Air-TeQ for that sales and distribution of their Quick Instruments solutions within the Nordic, Baltic and Benelux area. “Testonica is a valued partner of ours already for quite some time, so it’s additionally a pleasure for all of us their Quick Instruments are actually ready for distribution”, states Director at Air-TeQ, Lars Kongsted-Jensen. “It’s opening new doorways to all of us their embedded instrument IPs now may be used inside a more open and versatile way”.
Find Out More
Testonica delivers technology for Marginal Defect recognition on DDR3/4 bus
- 26.09.2017
- ChipVORX
DDR3
DDR4
Embedded Instrumentation
FPGA
Marginal Defects
NFF
No-fault Found
Little Difficulty Found
NTF
Quick Instruments

Marginal Defects, for example excessive voids in solder joints, dewetting, mind-in-pillow and alike don’t always cause malfunctions, but may lead to system performance issues, elevated error rates, intermittent problems along with other sporadic stability issues noticed in certain operation modes, at certain workloads or occurring inside a apparently stochastic manner. Consequently, Marginal Defects can lead to No-faultOrDifficulty Found (NFF/NTF) scenarios.
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IEEE I&M Magazine printed our technical paper
- 12.09.2017
- ChipVORX
Embedded Instrumentation
FPGA
Quick Instruments

In the August-Sept issue, IEEE Instrumentation & Measurement Magazine printed our technical paper which was initially presented this past year at AUTOTESTCON conference in Anaheim, CA. It is among six conference papers selected for that journal on the quality basis from the total of 80 AUTOTESTCON’2016 contributions.
Resourse: http://testonica.com/